MIMOS’ Advanced Analytical
Failure Analysis, Material Analysis and Nano Characterization Labs are equipped with a complete spectrum of state-of-art analytical and characterisation instruments
MIMOS’ Advanced Analytical Laboratory
As National applied R&D centre, we have been providing high value-added services for the industry and academia by offering its technological capabilities and advanced analytical facilities such as such as Transmission Electron Microscope (TEM), Dual Beam System, Time of Flight - Secondary Ion Mass Spectrometry (TOF-SIMS), Auger Electron Spectroscopy (AES) and X-ray Photoelectron Spectroscopy (XPS),
Meeting Industrial Needs With Tech Capabilities
MIMOS Analytical Laboratory has played an active role as an enabler to facilitate the growth of local E&E in Malaysia. It is an important ecosystem to support the semiconductor industry that comprises IC design, wafer fabrication, packaging assembly and board assembly on failure analysis and material analysis.
Dr. Lai CY
Technical Staff Infineon Technologies (Malaysia) Sdn Bhd
Thanks for the quality services provided during the past few years. Beside short analysis cycle time, the details analysis reporting also helping us (industries) a lot for daily root cause problem-solving. Overall, thanks for the great services provide and keep it up
Johan Iskandar Hasan
Managing Director NanoVerify Sdn Bhd
My company used the lab since 2015. The lab delivered quality services within schedule. We are very satisfiedd
Gary Chan
Senior member of technical staff NXP Semiconductor Sdn Bhd
The lab provides a wide variety of failure analysis services at reasonable price with excellent service and turnaround time. Their staff are very helpful and very attentive to customer needs
MIMOS Advanced Analytical Laboratory
- Real-time X-Ray (2D) & 3D X-Ray
- Curve Tracer (Logic, High Voltage & High Current)
- Photon Emission Microscope (PEM) with Back-side Capability + Optical Beam Induced Resistance Change (OBIRCH)
- Thermal Emission Microscope with Lock-in Function
- Field Emission Gun Scanning Electron Microscope (FESEM) with STEM + Energy Dispersive Spectrometer (EDS)
- Variable Pressure - Field Emission Gun Scanning Electron Microscope (VP-FESEM) + Energy Dispersive Spectrometer (EDS) + Wavelength Dispersive X-Ray Analysis (WDS) + Electron Backscatter Diffraction (EBSD) + Cathodoluminescence (CL)
- Dual Beam System with Scanning Transmission Electron Microscope (STEM) + Energy Dispersive Spectrometer (EDS)
- Plasma Dual Beam System + Energy Dispersive Spectrometer (EDS) + Electron Backscatter Diffraction (EBSD) + fibSIMS capabilities
- Transmission Electron Microscope (TEM) + Selected Area (electron) Diffraction (SAED) + Energy Dispersive Spectrometer (EDS) + Electron Energy Loss Spectroscopy (EELS)
- Nano-indenter and Micro-indenter with Scanning Probe Microscopy (SPM) and Atomic Force Microscopy (AFM)
- Atomic Force Microscopy (AFM)
- Time of Flight - Secondary Ion Mass Spectrometry (TOF-SIMS)
- Auger Electron Spectroscopy (AES)
- Multi-technique X-ray Photoelectron Spectroscopy (XPS) with Ultraviolet Photoelectron Spectroscopy (UPS), Ion Scattering Spectrometer (ISS) and Reflection Electron Energy Loss Spectroscopy (REELS) capabilities
- X-ray Photoelectron Spectroscopy (XPS) + Gas Cluster Ion Beam (GCIB)
- Raman Spectroscopy with 4 lasers (325nm(UV), 473(Blue), 532(Green), 785(NIR))